This is what worked for me,
1.5mm*15mm*15mm thermal pads between the chipset and the chipset cover (cough heatsink), then on top of the chipset cover I used heatsink adhesive to glue .3mm copper shims to it and on the other side used Artic 5 compound. Now it stays nice and cool and you can feel the heat being transfered to the back lid. The tablet comes apart very easy and it was well worth the 30-45 minutes I spent on it. Links to the items I used below.
http://www.ebay.com/itm/221339482358
http://www.ebay.com/itm/171241106495