Finally got around to doing the thermal mod based on the method described in the video as follows
Take aluminium heatsink off
Remove Thermal pad from CPU
Replace with Thermal Paste (Arctic Silver MX-4)
Place 20 x 20x 1mm copper shim on CPU
Place thermal paste on Copper Chip
Place aluminium Heatsink back on
Place original thermal pad ontop and Arctic Thermal pad on the upper section of heatsink
Results look very promising. Maximum temperature on load seems to now be 62c or so (Although bear in mind that I have also undervolted CPU, Cache, GPU by 70mv
Previously running god of war via ppsspp (psp emulator) would run full speed but would throttle if Resolution was set to x4 (GPU would throttle to lower speeds and show 100% usage maxed out for gpu load)
Now no throttling on GPU and full frame rate on the same test utilising only 70% gpu load.
A few questions and some things I am worried about however
Is there a possibility that eventually the copper shim may somehow slip inside (In particular if the tablet is always held in a upright laptop position?
I am hoping that the arctic paste may eventually give a stronger bond when heated and used? The Shim already seemed to be sticking onto the cpu pretty well
Heat on the back is not too much of a problem, pretty much the same as before (Hot). I have noticed that the heat still seems to be localised and not much heat near the battery (which is good), Should the whole plate area in the back cover be hot? I am 100% sure that the thermal pads are properly placed (And I even used another 1mm arctic pad in another area of the aluminium plate.
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