hmm, just realized i double created an account here and therefore deleted the other and am using this one now! as previously mentioned, i am using a 20x20x0.8mm copper shim..so what i did was core m3 -> thermal paste -> copper shim -> thermal paste -> OG heatsink -> OG thermal pad -> blackplate. Personally i think its okay, but I think if i were to redo it again, i’d go 20x20x0.5mm cos I get this weird rainbow effect on my screen (like when something is pressed against the screenprotector). No impact on my usage, but would prefer if it wasnt there to begin with.
Owned this thing for about 3 months now, all i can say is temps from HwInfo is good, games at around 60-70deg celcius, but the backplate gets really really hot at that spot where the OG thermal pad is in contact with to the backplate.