Intel Lakefield

Intel Lakefield Announced: The First 3D Stacked CPU, with 10nm Manufacturing Process

At the CES 2019 currently taking place in Las Vegas, giant chip-manufacturer – Intel – announced their first Foveros hybrid package-based product, the Lakefield SoC for mobile platforms. Now you might be asking yourself: what’s Foveros? Well, Foveros is a new 3D chip packaging technology announced back in December. It introduces 3D stacking design for CPU processor for the first ...[Read More]

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