Lenovo’s much rumored Z5s was set to launch on December 6th and become the first ever phone with a camera cut out hole to hit the market, but the company opted – at the last moment – to delay its launch to the 18th.
To kill the time, Lenovo, or at least its Vice President – Chang Cheng, decided to tease the handset over on the Chinese social network Weibo. In the image released online, there’s a clear hint at the SoC the Lenovo Z5s will pack, we’re talking about a Qualcomm Snapdragon 678.
The Snapdragon 678 is a CPU that has actually never been seen before, so it would mean the Z5s will be the first phone with such chipset. Being Lenovo though, we’re a bit skeptical about the veracity of the teaser, anybody remembers what they claimed about the Z5 before launch?
The only certain data we have at the moment is the one that came from TENAA (China’s certification authority) around a week back, which gives the handset with three rear cameras, a rear fingerprint scanner and dimensions of 156.7×74.5×7.8mm. Other features we expect to see include a 6.3-inch display with the punch hole camera in the upper part, the previously mentioned Snapdragon 678 CPU and Android 9 Pie out of the box.
Hopefully Lenovo do keep their promises and bring this new chip never talked about before this day. If they don’t, well, it’s Lenovo, are you really surprised? They didn’t earn the label “Lienovo” for no reason.